We can process aluminum parts of semiconductor manufacturing equipment with low distortion, which require precision (flatness, multiple holes, small diameter holes, surface roughness, etc.). Please leave hole processing, thin material processing, groove processing and so on. Focusing on machining and NC milling, in addition to parts processing, we can consistently handle wire processing, heat treatment, surface treatment, etc. in cooperation with processing companies in Hachioji city. Please leave it to one prototype.
Our technology
-
-
Semiconductor manufacturing equipment parts
There is a hole of Φ3H7 depth 0.5 ± 0.05mm from the back of the countersink. Jigs are manufactured and processed on both sides.
A5052
-
-
Semiconductor manufacturing equipment parts
Wafer suction plate
A5052 t3.0 Φ280
-
-
Semiconductor manufacturing equipment parts
Parts for inspection equipment
A5052 65x75x160
-
-
Semiconductor manufacturing equipment base plate
One chuck processing is impossible with the size of our equipment. Half-finished, front and back, completed after a total of 4 setup changes.
A5052 20x800x1200
-
-
Semiconductor manufacturing equipment
Bakelite 15x100x400
-
-
Semiconductor manufacturing equipment
Part of jig used for workpiece alignment. Low cost production is now possible with 1 chuck processing.
A5052
Idea STORY1
-
-
Semiconductor manufacturing equipment parts Ultra small parts (0.6×0.6×1.2) alignment plate
A2017 t10.0x100x150
Ultra precision high speed spindle was used for fine processing. The spindle in the machining center is not turned, and the motor in the spindle is controlled from the outside. Cutting at ideal machining conditions at high rotation speed of MAX50000min-1 leads to shortening of machining time. Another feature is that it uses less power because it does not use a motor with a large spindle.
Idea STORY2
-
-
Φ0.65 ± 0.02 × 3mm pin shaving. 500 processing. Glass bead blasting.
The customer requested that “I want to make 1100 holes in the plate and press-fit 1100 pins (diameter 0.65mm, length 8mm)”. We proposed changes to the processing method and realized everything by machining aluminum. As a result, the cost was significantly reduced (1/3 of the initial cost).
